Apple plans to use Qualcomm’s ultrasonic fingerprint sensor technology on an iPhone model to be released in 2020
Apple plans to use Qualcomm’s ultrasonic fingerprint sensor technology on an iPhone model to be released in 2020.
The iPhone maker has partnered with Taiwanese touchscreen maker GIS to develop an iPhone by 2020 or 2021 that could use insufficient display technology, MacRumors said on Wednesday.
Qualcomm unveiled the new Sonic Max 3D ultrasonic fingerprint reader on Tuesday at the third annual Snapdragon Technology Summit.
Qualcomm provides ultrasonic fingerprint sensors for Samsung’s Galaxy S10 and Galaxy Note10 smartphones. But iPhones can use an even more advanced version of the technology by 2020 or 2021.
JP Morgan analyst Samik Chatterjee believes Apple will launch a 5.4-inch iPhone, two 6.1-inch iPhones and a 6.7-inch iPhone with 5G connectivity in 2020.
Chatterjee expects the company to be able to introduce two state-of-the-art models (one 6.1-inch and one 6.7-inch) with mmWave support, plus a triple-lens camera and “world-facing” 3D sensor for features. enhanced augmented reality.
Meanwhile, two low end models (6.1 inches, 5.4 inches) will not have mmWave or World with 3D detection and will have a dual lens camera.
According to the report, Apple can use Qualcomm’s X55 modems on all its 2020 iPhones, which support the mmWave and sub-6GHz spectrum.
All four iPhone models will have OLEDs. Apple may be using thinner Samsung OLED monitors than the monitors currently in use.